IP Library › Assignment 064694/0774
Patent Assignment
Reel/Frame 064694/0774

Assignment of Assignor's Interest

Recorded: 2023-08-24 Pages: 5
Assignors
SU, HSIN-WEN
Executed: 2021-11-17
LIN, SHIH-HAO
Executed: 2021-11-17
LIN, YU-KUAN
Executed: 2021-11-17
HUNG, LIEN-JUNG
Executed: 2021-11-17
WANG, PING-WEI
Executed: 2021-11-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Semiconductor Memory Structure
Application: 18/357,838 →
Publication: US 2023/0371248