IP Library Assignment 064709/0038
Patent Assignment
Reel/Frame 064709/0038

Assignment of Assignor's Interest

Recorded: 2023-08-25 Pages: 5
Assignors
CHIU, CHIA-PIN
Executed: 2023-08-16
HOSSEINI, KAVEH
Executed: 2023-08-15
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Photonics Integrated Circuit Embedded in a Glass Substrate and Optically Coupled with a Photonic Wire Bond
Application: 18/236,216 →
Publication: US 2025/0067925
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 9, 2025
From: INTEL CORPORATION
To: ALTERA CORPORATION
Reel/Frame 072704/0307 →
Security Interest Sep 12, 2025
From: ALTERA CORPORATION
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 073431/0309 →