IP Library › Assignment 064768/0523
Patent Assignment
Reel/Frame 064768/0523

Assignment of Assignor's Interest

Recorded: 2023-08-31 Pages: 8
Assignors
LEE, KYUWON
Executed: 2023-08-30
JANG, JIWON
Executed: 2023-08-30
KIM, MYEONGJIN
Executed: 2023-08-30
KIM, HYESUN
Executed: 2023-08-30
LEE, YOUNGDEUK
Executed: 2023-08-30
WOO, YOUNGJIN
Executed: 2023-08-30
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property (1)
Semiconductor Device and Method of Forming Dummy SOP Within Saw Street
Application: 18/459,196 →
Publication: US 2025/0079372