Patent Assignment
Reel/Frame 064776/0845
Assignment of Assignor's Interest
Recorded: 2023-09-01
Pages: 10
Assignors
MAEKURA, TAKAYUKI
Executed: 2022-12-01
IWAI, TAKAAKI
Executed: 2022-11-30
OGAWA, HIROYUKI
Executed: 2022-11-30
MATSUNO, KOICHI
Executed: 2022-11-29
Assignee
SANDISK TECHNOLOGIES LLC
5080 SPECTRUM DRIVE, SUITE 1050W, ADDISON, TEXAS, 75001
Covered Properties
(2)
Stairless Three-Dimensional Memory Device and Method of Making Thereof by Forming Replacement Word Lines Through Memory Openings
Application:
18/352,726 →
Publication:
US 2024/0179905
Stairless Three-Dimensional Memory Device and Method of Making Thereof by Forming Replacement Word Lines Through Memory Openings
Application:
63/385,328 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 1, 2023
From: MAEKURA, TAKAYUKI; IWAI, TAKAAKI; IZUMI, KEISUKE
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 065423/0389 →
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →