IP Library › Assignment 064863/0862
Patent Assignment
Reel/Frame 064863/0862

Assignment of Assignor's Interest

Recorded: 2023-09-11 Pages: 5
Assignors
KWON, HYUNG SOON
Executed: 2023-08-07
KIM, HYOUNG UK
Executed: 2023-08-07
KIM, KYUNG SIK
Executed: 2023-08-07
HONG, JI SU
Executed: 2023-08-07
BAIK, SEUNG IN
Executed: 2023-08-07
CHOI, MIN YOUNG
Executed: 2023-08-07
PARK, SI TAEK
Executed: 2023-08-07
LEE, JONG HWAN
Executed: 2023-08-07
PARK, JAE SUNG
Executed: 2023-08-07
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Multilayer Electronic Component
Application: 18/244,696 →
Publication: US 2024/0242884