Multilayer electronic component
A multilayer electronic component includes a dielectric layer and internal electrodes; wherein the dielectric layer includes a rare earth element, Mn, and Ti. The rare earth element includes a first rare earth element including Dy and Tb, and a second rare earth element including a rare earth element different from the first rare earth element. The number of moles of the rare earth element is defined as RE, the number of moles of Dy is defined as A1, the number of moles of Tb is defined as A2 based on 100 moles of Ti included in the dielectric layer, and 0.5 mol≤RE≤0.9 mol and 1<A2/A1 are satisfied. The number of moles of the second subcomponent element based on 100 moles of Ti included in the dielectric layer is 0.2 mole or more and 0.5 mole or less.
1 . A multilayer electronic component, comprising:
a body including a dielectric layer and internal electrodes; and
external electrodes disposed on the body,
wherein the dielectric layer includes Ti, a first subcomponent element including a rare earth element, and a second subcomponent element including Mn,
wherein the rare earth element includes a first rare earth element including Dy and Tb, and a second rare earth element including a rare earth element different from the first rare earth element,
wherein, the number of moles of the rare earth element is defined as RE, the number of moles of Dy is defined as A1, and the number of moles of Tb is defined as A2 based on 100 moles of Ti included in the dielectric layer, and 0.5 mol≤RE≤0.9 mol and 1<A2/A1 are satisfied,
wherein the number of moles of the second subcomponent element based on 100 moles of Ti included in the dielectric layer is 0.2 mole or more and 0.5 mole or less, and
wherein the second rare earth element includes one or more of Gd, Ho and Y.
2 . The multilayer electronic component of claim 1 ,
wherein the dielectric layer further includes a third subcomponent including Mg, and
wherein the number of moles of the third subcomponent element based on 100 moles of Ti included in the dielectric layer is 0.01 mole or more and 0.3 mole or less.
3 . The multilayer electronic component of claim 1 , wherein the rare earth element further includes one or more of Gd, Ho, Sm, Y, Er, Ce, Nd, Tm, La, and Yb.
4 . The multilayer electronic component of claim 1 , wherein the second subcomponent element further includes one or more of V, Cr, Fe, Ni, C, and Zn.
5 . The multilayer electronic component of claim 1 ,
wherein the dielectric layer further includes a fourth subcomponent element including Si, and
wherein the number of moles of the fourth subcomponent element based on 100 moles of Ti included in the dielectric layer is 1.0 mole or more and 5.0 mole or less.
6 . The multilayer electronic component of claim 1 , wherein the dielectric layer includes a plurality of dielectric layers, and a thickness of at least one of the plurality of dielectric layers is 0.45 μm or less.
7 . The multilayer electronic component of claim 1 , wherein a thickness of at least one of the internal electrodes is 0.45 μm or less.
8 . The multilayer electronic component of claim 1 , wherein properties of TCC (Temperature Coefficient of Capacitance) in a temperature range of −55° C. to 105° C. is satisfied −22% to +22%.
9 . The multilayer electronic component of claim 1 , wherein the body includes a capacitance forming portion including the dielectric layer and the internal electrodes alternately disposed with the dielectric layer in a lamination direction, and a cover portion disposed on each of both end surfaces in the lamination direction of the capacitance forming portion.
10 . The multilayer electronic component of claim 9 , wherein an average thickness of the cover portion in the lamination direction is 20 μm or less.
11 . The multilayer electronic component of claim 9 , wherein a direction in which the external electrodes are disposed is defined as a length direction, and a side margin portion disposed on each of both end surfaces of the body in a width direction is included.
12 . The multilayer electronic component of claim 11 , wherein an average thickness of the side margin portion in the width direction is 20 μm or less.
13 . The multilayer electronic component of claim 1 , wherein one of the external electrodes includes an electrode layer disposed on the body and connected to one or more of the internal electrodes and a plating layer disposed on the electrode layer.
14 . The multilayer electronic component of claim 1 , wherein RE=A1+A2+RE2, in which RE2 is the number of moles the second rare earth element based on 100 moles of Ti included in the dielectric layer.
15 . A multilayer electronic component, comprising:
a body including a dielectric layer and internal electrodes; and
external electrodes disposed on the body, wherein the dielectric layer includes Ti, a first subcomponent element including a rare earth element, and a second subcomponent element including Mn,
wherein the rare earth element includes a first rare earth element including Dy and Tb, and a second rare earth element including a rare earth element different from the first rare earth element, wherein, the number of moles of the rare earth element is defined as RE, the number of moles of Dy is defined as A1, and the number of moles of Tb is defined as A2 based on 100 moles of Ti included in the dielectric layer, and 0.7 mol≤RE≤0.9 mol and 1<A2/A1 are satisfied, and
wherein the number of moles of the second subcomponent element based on 100 moles of Ti included in the dielectric layer is 0.2 mole or more and 0.5 mole or less,
wherein the dielectric layer further includes a third subcomponent including Mg, and wherein the number of moles of the third subcomponent element based on 100 moles of Ti included in the dielectric layer is 0.01 mole or more and 0.3 mole or less.
16 . The multilayer electronic component of claim 15 , wherein the rare earth element includes one or more of Gd, Ho, Sm, Y, Er, Ce, Nd, Tm, La, and Yb.
17 . The multilayer electronic component of claim 16 , wherein the second rare earth element includes one or more of Gd, Ho, Sm, and Y.