Patent Assignment
Reel/Frame 064874/0446
Assignment of Assignor's Interest
Recorded: 2023-09-12
Pages: 3
Assignors
MANDALAPU, CHANDRASEKHAR
Executed: 2021-09-17
FOUNTAIN, GAIUS GILLMAN, JR.
Executed: 2021-08-09
GAO, GUILIAN
Executed: 2021-09-16
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Dbi to Si Bonding for Simplified Handle Wafer
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.