Patent Assignment
Reel/Frame 064874/0610
Change of Name
Recorded: 2023-09-12
Pages: 4
Assignor
INVENSAS BONDING TECHNOLOGIES, INC.
Executed: 2022-08-15
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Dbi to Si Bonding for Simplified Handle Wafer
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.