IP Library › Assignment 064876/0991
Patent Assignment
Reel/Frame 064876/0991

Assignment of Assignor's Interest

Recorded: 2023-09-12 Pages: 3
Assignors
JUNG, CHUNGHYO
Executed: 2023-09-07
PARK, SEONMI
Executed: 2023-09-07
PARK, HYEIN
Executed: 2023-09-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Method for Producing Injection-Molded Article and Electronic Device Comprising Injection-Molded Article
Application: 18/465,525 →
Publication: US 2023/0415439