Method for producing injection-molded article and electronic device comprising injection-molded article
A method for producing an injection-molded article, according to various embodiments, comprises: molding an injection-molded article; irradiating, in a primary irradiation operation, a laser on primary irradiation regions spaced from each other, on at least a portion of the surface of the injection-molded article; irradiating, in a secondary irradiation operation, a laser on secondary irradiation regions spaced from each other, on at least a portion of the surface of the injection-molded article; and, on the surface of the injection-molded article, forming a plating layer on the primary irradiation regions and the secondary irradiation regions, wherein each of the secondary irradiation regions may at least partially overlap with at least one of the primary irradiation regions.
1 . A method for producing an injection-molded article, the method comprising:
molding the injection-molded article;
irradiating, in a primary irradiation operation, a laser on primary irradiation areas spaced apart from each other, on at least a part of the surface of the injection-molded article;
irradiating, in a secondary irradiation operation, a laser on secondary irradiation areas spaced apart from each other, on at least a part of the surface of the injection-molded article; and
forming a plating layer on the primary irradiation areas and the secondary irradiation areas, on the surface of the injection-molded article,
wherein each of the secondary irradiation areas at least partially overlap at least one of the primary irradiation areas.
2 . The method of claim 1 , wherein, in the secondary irradiation operation, the laser is irradiated to overlap any one of the primary irradiation areas in a range of 20% or more and 30% or less of the laser diameter.
3 . The method of claim 1 , wherein the laser on the primary irradiation areas and the laser on the secondary irradiation areas are irradiated such that the primary irradiation areas and the secondary irradiation areas are alternately arranged.
4 . The method of claim 3 , wherein the laser on the secondary irradiation areas is irradiated such that one of the secondary irradiation areas overlaps two adjacent primary irradiation areas.
5 . The method of claim 1 , wherein the surface of the plating layer is configured to form a continuous curved surface or a continuous flat surface with an area on the surface of the injection-molded article to which the laser on the primary irradiation areas and the laser on the secondary irradiation areas have not been irradiated.
6 . The method of claim 5 , further comprising forming a decoration layer on at least a part of a surface of the injection-molded article and a surface of the plating layer on the surface where the plating layer is formed, the decoration layer comprising at least one of a deposition layer, a plating layer, a printing layer, or a paint layer.
7 . An electronic device comprising an injection-molded article produced by the method according to claim 1 .
8 . The electronic device of claim 7 , comprising:
a housing at least partially comprising a polymer material; and
a support accommodated inside the housing and at least partially comprising a polymer material,
wherein at least one polymer material portion of the housing and the support comprises the injection-molded article.
9 . The electronic device of claim 8 , further comprising:
a processing groove formed to include the primary irradiation areas and the secondary irradiation areas, the processing groove being recessed on the surface of at least one polymer material portion of the housing and the support; and
a conductive pattern formed of a metal material filled in the processing groove,
wherein the surface of the conductive pattern forms a continuous flat surface or a continuous curved surface with a surface of the polymer material portion.
10 . The electronic device of claim 9 , wherein at least one of the housing and the support further comprises:
on the surface where the conductive pattern is formed, a primer layer covering at least the conductive pattern; and
at least one decoration layer disposed on a surface of the primer layer.
11 . The electronic device of claim 9 , wherein the surface of the conductive pattern is at least partially lower than the surface of the polymer material portion.
12 . The electronic device of claim 9 , wherein, on the surface of the housing, the conductive pattern is disposed on a surface facing an external space.
13 . The electronic device of claim 9 , further comprising:
a printed circuit board disposed inside the housing; and
a processor or a communication module comprising communication circuitry disposed on the printed circuit board,
wherein the processor or the communication module is configured to perform wireless communication using the conductive pattern.
14 . The electronic device of claim 9 , wherein the conductive pattern comprises:
a nickel (Ni) layer formed on the bottom surface of the processing groove;
a copper (Cu) layer formed on the surface of the nickel layer;
a silver (Ag) layer formed on the surface of the copper layer; and
a second nickel layer formed on the surface of the silver layer.
15 . The electronic device of claim 9 , wherein the conductive pattern has a maximum thickness of 21.3 um or more and 27.4 um or less.