IP Library › Assignment 064889/0399
Patent Assignment
Reel/Frame 064889/0399

Assignment of Assignor's Interest

Recorded: 2023-09-13 Pages: 4
Assignors
HABA, BELGACEM
Executed: 2023-08-07
KATKAR, RAJESH
Executed: 2023-08-07
VARIOT, PATRICK
Executed: 2023-09-10
SHEN, HONG
Executed: 2023-08-07
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Thermoelectric Cooling for Die Packages
Application: 18/067,655 →
Publication: US 2023/0197559
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →