Patent Assignment
Reel/Frame 064918/0271
Assignment of Assignor's Interest
Recorded: 2023-09-15
Pages: 4
Assignors
HUANG, PO-YU
Executed: 2021-04-27
LEE, CHEN-MING
Executed: 2021-04-27
WU, I-WEN
Executed: 2021-04-27
YANG, FU-KAI
Executed: 2021-05-14
WANG, MEI-YUN
Executed: 2021-04-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Devices with Backside via and Methods Thereof