Patent Assignment
Reel/Frame 065013/0195
Assignment of Assignor's Interest
Recorded: 2023-09-25
Pages: 4
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Processing Method of Bonded Wafer