Patent Assignment
Reel/Frame 065046/0066
Assignment of Assignor's Interest
Recorded: 2023-09-27
Pages: 4
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Method of Processing a Wafer