IP Library › Assignment 065050/0391
Patent Assignment
Reel/Frame 065050/0391

Assignment of Assignor's Interest

Recorded: 2023-09-27 Pages: 5
Assignor
MICRON TECHNOLOGY, INC.
Executed: 2023-03-23
Assignee
LODESTAR LICENSING GROUP, LLC
1603 ORRINGTON AVE, SUITE 600, EVANSTON, ILLINOIS, 60201
Covered Properties (2)
Semiconductor Device Having a Stack of Data Lines with Conductive Structures on Both Sides Thereof
Application: 16/664,280 →
Publication: US 2021/0126007
Method for Manufacturing a Memory Structure having Stacked Data Lines and Conductive Structures on Sides thereof
Application: 17/966,594 →
Publication: US 2023/0043786
Related Assignments (1)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 25, 2019
From: CLAMPITT, DARWIN A.; LINDSAY, ROGER W.; RITCHIE, CHRISTOPHER R.; LYONSMITH, SHAWN D.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050831/0105 →