Patent Assignment
Reel/Frame 065064/0400
Assignment of Assignor's Interest
Recorded: 2023-09-28
Pages: 10
Assignors
TATEOKA, AYUMU
Executed: 2023-07-10
KANEYAMA, RYOSUKE
Executed: 2023-07-12
HARA, YASUJI
Executed: 2023-07-18
SATO, YASUO
Executed: 2023-07-21
OBATA, SHINICHI
Executed: 2023-07-04
LI, CHUN CHIEH
Executed: 2023-07-04
Assignee
MITSUI MINING & SMELTING CO., LTD.
1-11-1 OSAKI, SHINAGAWA-KU, TOKYO, 1418584, JAPAN
Covered Property
(1)
Roughened Copper Foil, Copper-Cladded Laminate Board, and Printed Wiring Board
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.