Patent Assignment
Reel/Frame 065073/0356
Assignment of Assignor's Interest
Recorded: 2023-09-29
Pages: 5
Assignee
QUALCOMM TECHNOLOGIES, INC.
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property
(1)
Die Package with Guard Structure to Reduce or Prevent Material Seepage into Air Cavity, and Related Fabrication Methods
Application:
18/467,798 →
Publication:
US 2025/0096164
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.