Assignment of Assignor's Interest

Recorded: 2023-09-29 Pages: 7

Assignors

HO, SHOOK FOONG

Executed: 2023-09-25

YONG, POH HOONG

Executed: 2023-09-21

KU, HUAN EN

Executed: 2023-09-25

Assignee

RF360 SINGAPORE PTE. LTD.

80 ROBINSON ROAD #02-00, SINGAPORE, 068898, SINGAPORE

Covered Property (1)

Die Package with Guard Structure to Reduce or Prevent Material Seepage into Air Cavity, and Related Fabrication Methods

Application: 18/467,798 →

Publication: US 2025/0096164

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.