Assignment of Assignor's Interest

Recorded: 2023-09-29 Pages: 3

Assignors

SHIOKAWA, HIROFUMI

Executed: 2023-09-15

FUJINO, HIROAKI

Executed: 2023-09-15

HIRAI, YOJI

Executed: 2023-09-15

Assignee

SHOWA DENKO MATERIALS CO., LTD.

9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 1006606, JAPAN

Covered Property (1)

Molded Body, and Method for Producing Molded Body

Application: 17/775,037 →

Publication: US 2022/0402445

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.