Patent Assignment
Reel/Frame 065127/0806
Change of Name
Recorded: 2023-10-04
Pages: 12
Assignor
SHOWA DENKO MATERIALS CO., LTD.
Executed: 2023-01-01
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Properties
(2)
Molded Body, and Method for Producing Molded Body
Application:
17/775,037 →
Publication:
US 2022/0402445
Method for Manufacturing Laminate
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 13, 2023
From: MORIHARA, MASUMI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062369/0814 →
Assignment of Assignor's Interest
Sep 29, 2023
From: SHIOKAWA, HIROFUMI; FUJINO, HIROAKI; HIRAI, YOJI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 065074/0569 →
Change of Address
Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →