Patent Assignment
Reel/Frame 065090/0046
Assignment of Assignor's Interest
Recorded: 2023-10-02
Pages: 4
Assignors
TSUYUNO, NOBUTAKE
Executed: 2023-06-29
MATSUSHITA, AKIRA
Executed: 2023-06-29
KANEKO, YUJIRO
Executed: 2023-06-28
Assignee
HITACHI ASTEMO, LTD.
2520, TAKABA, HITACHINAKA-SHI, IBARAKI, JAPAN
Covered Property
(1)
Semiconductor Module, Power Conversion Device, and Manufacturing Method of Semiconductor Module