Patent Assignment
Reel/Frame 065121/0588
Assignment of Assignor's Interest
Recorded: 2023-10-04
Pages: 4
Assignor
OTSUKA, YOSHITAKA
Executed: 2020-07-22
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Bonding System