Patent Assignment
Reel/Frame 065173/0049
Assignment of Assignor's Interest
Recorded: 2023-10-10
Pages: 4
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Optical Co-Packaging on a Glass Substrate with 3D Die-Stacking
Application:
18/478,871 →
Publication:
US 2025/0110270
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.