Patent Assignment
Reel/Frame 065274/0329
Assignment of Assignor's Interest
Recorded: 2023-10-18
Pages: 4
Assignors
TSAI, YI-LIN
Executed: 2021-03-11
HSU, WEN-SUNG
Executed: 2021-03-11
PENG, I-HSUAN
Executed: 2021-03-10
LIN, YI-JOU
Executed: 2021-03-10
Assignee
MEDIATEK INC.
NO.1, DUSING 1ST RD., HSINCHU SCIENCE PARK, HSINCHU CITY, 30078, TAIWAN
Covered Property
(1)
Semiconductor Package Structure