Patent Assignment
Reel/Frame 065277/0826
Assignment of Assignor's Interest
Recorded: 2023-10-19
Pages: 3
Assignor
XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Executed: 2023-10-16
Assignee
QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD.
YUANQIAN VILLAGE, SHIJING TOWN, NANAN CITY, QUANZHOU CITY, FUJIAN PROVINCE, CHINA
Covered Properties
(4)
Flip-Chip LED Structure and Fabrication Method
A Light-Emitting Diode Having a First Electrode Contacting a First Semiconductor Layer at the Pad Area and an Extended Portion Formed on a Transparent Conductive Layer
Application:
16/147,604 →
Publication:
US 2019/0115511
Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LED Chip
Application:
17/806,497 →
Publication:
US 2023/0088776
Light Emitting Diode and Fabrication Method Thereof
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 29, 2018
From: LIN, SU-HUI; HONG, LINGYUAN; HSU, SHENG-HSIEN; CHEN, SIHE
To: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 047013/0580 →
Assignment of Assignor's Interest
Aug 23, 2021
From: HE, ANHE; LIN, SU-HUI; ZHENG, JIANSEN; PENG, KANGWEI
To: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 057261/0390 →
Assignment of Assignor's Interest
Jun 12, 2022
From: HE, ANHE; LIN, SUHUI; ZHENG, JIANSEN; PENG, KANGWEI
To: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 060174/0663 →
Assignment of Assignor's Interest
Oct 31, 2022
From: MENG, CHENG; JIA, YUEHUA; WANG, JING; WU, CHUN-YI
To: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 061595/0560 →