Patent Assignment
Reel/Frame 065286/0704
Assignment of Assignor's Interest
Recorded: 2023-10-19
Pages: 14
Assignors
LI, KUN-JU
Executed: 2023-10-11
LIU, HSIN-JUNG
Executed: 2023-10-11
CHEN, JHIH YUAN
Executed: 2023-10-11
LAI, I-MING
Executed: 2023-10-11
CHAN, ANG
Executed: 2023-10-11
GAO, WEI XIN
Executed: 2023-10-11
CHIEN, HSIANG CHI
Executed: 2023-10-11
HSU, HAO-CHE
Executed: 2023-10-11
HOU, CHAU CHUNG
Executed: 2023-10-11
WU, ZONG SIAN
Executed: 2023-10-11
Assignee
UNITED MICROELECTRONICS CORP.
NO. 3, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK,, HSINCHU, TAIWAN
Covered Property
(1)
Manufacturing Method of Semiconductor Structure