IP Library › Assignment 065317/0788
Patent Assignment
Reel/Frame 065317/0788

Assignment of Assignor's Interest

Recorded: 2023-10-23 Pages: 28
Assignors
SAFRANEK, ROBERT J.
Executed: 2015-06-29
BLANKENSHIP, ROBERT G.
Executed: 2015-09-03
IYER, VENKATRAMAN
Executed: 2015-07-20
WILLEY, JEFF
Executed: 2015-09-21
BEERS, ROBERT
Executed: 2015-07-02
JUE, DARREN S.
Executed: 2015-07-01
KUMAR, ARVIND A.
Executed: 2015-07-27
SHARMA, DEBENDRA DAS
Executed: 2015-06-25
SWANSON, JEFFREY C.
Executed: 2015-06-24
FAHIM, BAHAA
Executed: 2015-09-21
GEETHA, VEDARAMAN
Executed: 2015-09-03
SPINK, AARON T.
Executed: 2001-08-08
SPAGNA, FULVIO
Executed: 2015-09-04
SHAH, RAHUL R.
Executed: 2015-09-29
IYER, SITARAMAN V.
Executed: 2015-07-17
NALE, WILLIAM HARRY
Executed: 2015-09-03
DAS, ABHISHEK
Executed: 2015-09-08
JOHNSON, SIMON P.
Executed: 2015-08-31
DHILLON, YUVRAJ S.
Executed: 2015-06-26
LIU, YEN-CHENG
Executed: 2015-09-01
RAMANUJAN, RAJ K.
Executed: 2015-09-02
MADDOX, ROBERT A.
Executed: 2015-06-30
HUM, HERBERT H.
Executed: 1996-01-08
GUPTA, ASHISH
Executed: 2015-07-01
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Properties (6)
High Performance Interconnect
Application: 15/393,153 →
Publication: US 2017/0109315
High Performance Interconnect
Application: 16/285,035 →
Publication: US 2019/0391939
High Performance Interconnect
Application: 16/937,499 →
Publication: US 2020/0356502
High Performance Interconnect
Application: 17/134,242 →
Publication: US 2021/0117350
High Performance Interconnect
Application: 17/556,853 →
Publication: US 2022/0114122
High Performance Interconnect
Application: 18/347,236 →
Publication: US 2024/0012772