Patent Assignment
Reel/Frame 065424/0243
Assignment of Assignor's Interest
Recorded: 2023-11-01
Pages: 7
Assignors
LEE, SANGHEON
Executed: 2023-06-20
LEE, JUNGHO
Executed: 2023-06-20
CHO, YOUNGJAE
Executed: 2023-06-20
CHOI, MICHAEL
Executed: 2023-06-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Bootstrap Circuit and Communication Device Including the Same
Application:
18/386,122 →
Publication:
US 2024/0146292