Patent Assignment
Reel/Frame 065424/0560
Assignment of Assignor's Interest
Recorded: 2023-11-01
Pages: 14
Assignors
HOSODA, NAOHIRO
Executed: 2023-02-01
TSUTSUMI, MASANORI
Executed: 2023-02-01
TAKUMA, SHUNSUKE
Executed: 2023-02-01
SHIMABUKURO, SEIJI
Executed: 2023-02-03
HINOUE, TATSUYA
Executed: 2023-02-01
KASHIMURA, TAKASHI
Executed: 2023-02-01
KUBO, TOMOHIRO
Executed: 2023-02-03
OTOI, HISAKAZU
Executed: 2023-02-03
TANAKA, HIROYUKI
Executed: 2023-02-01
MORIYAMA, TAKUMI
Executed: 2023-02-01
SUZUKI, RYOTA
Executed: 2023-02-03
Assignee
SANDISK TECHNOLOGIES LLC
5080 SPECTRUM DRIVE, SUITE 1050W, ADDISON, TEXAS, 75001
Covered Properties
(2)
Three-Dimensional Memory Device Containing Silicon Oxycarbide Liners and Methods of Forming the Same
Application:
18/356,896 →
Publication:
US 2024/0260266
Three-Dimensional Memory Device Containing Silicon Oxycarbide Liners and Methods of Forming the Same
Application:
63/481,622 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 3, 2023
From: HOSODA, NAOHIRO; TSUTSUMI, MASANORI; TAKUMA, SHUNSUKE; SHIMABUKURO, SEIJI
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 062581/0792 →
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →