Patent Assignment
Reel/Frame 065485/0660
Assignment of Assignor's Interest
Recorded: 2023-11-07
Pages: 12
Assignors
HOU, GUANHUA
Executed: 2023-10-26
WANK, ANDREW
Executed: 2023-10-26
WANG, TECHUN
Executed: 2023-11-01
VASQUEZ, NESTOR A.
Executed: 2023-10-27
MCCORMICK, JOHN R.
Executed: 2023-10-31
Assignee
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
451 BELLEVUE ROAD, NEWARK, DELAWARE, 19713
Covered Property
(1)
Dual-Layer Cmp Polishing Subpad
Application:
18/490,345 →
Publication:
US 2024/0181597
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC.
To: DUPONT ELECTRONIC MATERIALS HOLDING, INC.
Reel/Frame 069274/0160 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →