Patent Assignment
Reel/Frame 065486/0085
Assignment of Assignor's Interest
Recorded: 2023-11-07
Pages: 3
Assignors
HSUEH, YANG-CHIH
Executed: 2023-11-06
TSAI, YAN-ZUO
Executed: 2023-11-06
CHUNG, MING-TSU
Executed: 2023-11-06
LIN, YUNG-CHI
Executed: 2023-11-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Warpage Modulation Through Implantation and the Structures Thereof
Application:
18/503,853 →
Publication:
US 2025/0062247