Patent Assignment
Reel/Frame 065491/0422
Assignment of Assignor's Interest
Recorded: 2023-11-08
Pages: 5
Assignors
SIKKA, KAMAL K.
Executed: 2023-11-07
SAKUMA, KATSUYUKI
Executed: 2023-11-07
TOY, HILTON T.
Executed: 2023-11-07
LI, SHIDONG
Executed: 2023-11-07
BONAM, RAVI K.
Executed: 2023-11-07
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Electronic Package Structure With Offset Stacked Chips And Top And Bottom Side Cooling Lid