Electronic package structure with offset stacked chips and top and bottom side cooling lid

1. An electronic structure comprising:

three-dimensional chips arranged in a stack, wherein at least one chip of the three-dimensional chips is offset by at least one distance relative to another chip of the stack such that the at least one chip has an exposed surface not covered with the another chip; and

a two-piece lid structure configured to extract heat from the bottom and top of the stacked chips;

wherein at least one ledge of at least one piece of the two-piece lid structure covers the exposed surface, and a thermal interface material is applied between the at least one ledge of the at least one piece of the two-piece lid structure and the exposed surface.

2. The electronic structure of claim 1 , further comprising thermal interface material between exposed surfaces of the chips and surfaces of ledges of the lid structure.

3. The electronic structure of claim 1 , further comprising a carrier or substrate, wherein a first piece of the two-piece lid structure is connected to a surface of the carrier or substrate on one side of the stack, and a second piece of the two-piece lid structure is connected to the surface of the carrier or substrate on another side of the stack.

4. The electronic structure of claim 1 , wherein the stacked chips are offset in one direction.

5. The electronic structure of claim 1 , wherein the two-piece lid structure comprises microchannels for fluid convection to further extract heat from the stacked chips.

6. The electronic structure of claim 1 , wherein at least one of the stacked chips are hybrid bonded to another one of the stacked chips.

7. The electronic structure of claim 1 , wherein at least one of the stacked chips is wirebonded to another one of the stacked chips, and at least one of the stacked chips is wirebonded to a substrate that carries the electronic structure.

8. The electronic structure of claim 1 , further comprising:

an overmold applied to at least one side of at least one of the chips; and

a plurality of through vias within the overmold configured to extract heat from the stacked chips.

9. The electronic structure of claim 1 , further comprising:

at least one microcooler connected to at least one side of the stacked chips, wherein the at least one microcooler provides active thermal management; and

overmold applied to a side of the at least one microcooler, wherein a size of the overmold facilitates offsetting of the stacked chips.

10. The electronic structure of claim 9 , wherein two or more of the microcoolers are of different sizes to facilitate offsetting of the chips.

11. The electronic structure of claim 9 , wherein a first overmold is applied to a first side of one of the chips, and a second overmold is applied to a second side of the one of the chips, the first overmold applied to the first side being of a different size than the second overmold to applied to the second side.

12. The electronic structure of claim 1 , wherein the at least one distance by which the at least one chip is offset relative to the another chip of the stack is between one-twentieth of a width of the at least one chip and one-half of the width of the at least one chip.

13. The electronic structure of claim 1 , wherein the at least one distance between the at least one ledge of the at least one piece of the two-piece lid structure and the exposed surface of the at least one chip where the thermal interface material is applied is between 30 micrometers and 50 micrometers.

14. The electronic structure of claim 1 , wherein:

a distance between a ledge of a first piece of the two-piece lid structure and an exposed surface of a first chip where thermal interface material is applied is between 30 micrometers and 50 micrometers; and

a distance between a ledge of a second piece of the two-piece lid structure and an exposed surface of a second chip where thermal interface material is applied is between 30 micrometers and 50 micrometers.

15. The electronic structure of claim 9 , wherein a first microcooler is applied to a first side of one of the chips, and a second microcooler is applied to a second side of the one of the chips.

16. The apparatus of claim 15 , wherein a third microcooler is applied to a first side of another one of the chips, and a fourth microcooler is applied to a second side of the another one of the chips.

17. The electronic structure of claim 1 , wherein the at least one chip is offset by a first distance relative to the another chip in a first direction, and the at least one chip is offset by a second distance relative to the another chip in a second direction different from the first direction.

18. The electronic structure of claim 1 , wherein:

a first chip of the stack is offset by a first distance relative to a second chip of the stack in a first direction, and the first chip is offset by a second distance relative to the second chip in a second direction different from the first direction; and

a third chip of the stack is offset by a third distance relative to the second chip in a third direction opposite the first direction, and the third chip is offset by a fourth distance relative to the second chip in the second direction or a fourth direction different from the second direction.

19. The electronic structure of claim 1 , wherein:

a first piece of the two-piece lid structure is coupled to a second piece of the two-piece lid structure on one side of the stacked chips; and

the first piece of the two-piece lid structure is not coupled to the second piece of the two-piece lid structure on another side of the stacked chips.

20. The electronic structure of claim 1 , wherein the at least one ledge of the at least one piece of the two-piece lid structure projects from a portion of the at least one piece of the two-piece lid structure by a distance corresponding to the at least one distance by which at least one chip is offset relative to the another chip.