Patent Assignment
Reel/Frame 065497/0457
Assignment of Assignor's Interest
Recorded: 2023-11-08
Pages: 4
Assignors
UZOH, CYPRIAN EMEKA
Executed: 2023-10-19
THEIL, JEREMY ALFRED
Executed: 2023-11-08
FOUNTAIN, GAIUS GILLMAN, JR.
Executed: 2023-10-20
HABA, BELGACEM
Executed: 2023-10-19
KATKAR, RAJESH
Executed: 2023-10-19
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
System and Method for Bonding Transparent Conductor Substrates