Patent Assignment
Reel/Frame 065501/0804
Assignment of Assignor's Interest
Recorded: 2023-11-08
Pages: 4
Assignors
LIN, JIAN-HONG
Executed: 2021-01-11
HSIEH, MING-HONG
Executed: 2021-01-11
CHANG, HSIN-CHUN
Executed: 2021-01-11
WANG, MING-YIH
Executed: 2021-01-11
LU, YINGLUNG
Executed: 2021-01-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Through-Circuit Vias In Interconnect Structures