Patent Assignment
Reel/Frame 065514/0515
Assignment of Assignor's Interest
Recorded: 2023-11-09
Pages: 4
Assignor
HONG, JI HOON
Executed: 2023-06-26
Assignees
SILICON MITUS, INC.
USPACE-1 A DONG, 8TH FLOOR 660, DAEWANGPANGYO-RO, BUNDANG-GU, GYEONGGI-DO, SEONGNAM-SI, 13494, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF
HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
NO. 6 LIANHUI STREET, XIXING STREET, BINJIANG DISTRICT, ZHEJIANG PROVINCE, HANGZHOU CITY, 310051, CHINA
Covered Property
(1)
Wafer Level Chip Scale Package with Rhombus Shape
Application:
18/343,599 →
Publication:
US 2024/0317805
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.