IP Library Assignment 072337/0051
Patent Assignment
Reel/Frame 072337/0051

Change of Name

Recorded: 2025-08-05 Pages: 4
Assignor
Assignee
SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY (HANGZHOU) CO., LTD.
ROOM 608, BUILDING 1, NO.6 LIANHUI STREET, XIXING SUB-DISTRICT, BINJIANG DISTRICT, ZHEJIANG PROVINCE, HANGZHOU, CHINA
Covered Properties (37)
3-Level Buck-Boost Converter with Flying Capacitor Voltage Balancing Circuit
Application: 18/192,772 →
Publication: US 2023/0378872
3-Level Converter with Flying Capacitor Voltage Balancing Circuit
Application: 18/309,605 →
Publication: US 2023/0396168
Buck-Boost Converter Reducing Inductor Current
Application: 18/343,531 →
Publication: US 2023/0421063
Clock and Data Recovery Device
Application: 18/503,959 →
Publication: US 2024/0154616
Clock and Data Recovery Device
Application: 18/345,872 →
Publication: US 2024/0072811
Electromagnetic Induction Heating Apparatus for Heating an Aerosol-Forming Article of an Electronic Cigarette
Application: 18/189,856 →
Publication: US 2023/0309622
Electromagnetic Induction Heating Apparatus for Heating an Aerosol-Forming Article of an Electronic Cigarette and Driving Method Thereof
Application: 18/345,826 →
Publication: US 2024/0237157
Heating Apparatus for Aerosol-Forming Articles That Manages Temperature Using Frequency Information
Application: 18/815,541 →
Publication: US 2025/0072522
Led Light Emitting Device and Method of Driving the Same
Patent: 8,525,433 →
Application: 12/825,635 →
Publication: US 2011/0001433
Moisture Detection Circuits and Methods for Serial Bus Connectors
Application: 18/827,450 →
Publication: US 2025/0180771
Phase Locked Loop Having Fast Lock Function
Application: 18/425,818 →
Publication: US 2024/0388299
Switching Converter Equipped with Adaptive Frequency Control Function
Application: 18/403,203 →
Publication: US 2024/0266937
Switching Converter Equipped with Negative Current Tracking Control Function
Application: 18/404,674 →
Publication: US 2024/0339922
Wafer Level Chip Scale Package with Rhombus Shape
Application: 18/343,599 →
Publication: US 2024/0317805
Trench Mosfet and Manufacturing Method Thereof
Application: 18/542,278 →
Publication: US 2025/0048673
Trench Semiconductor Power Device and Layout Thereof
Application: 18/542,211 →
Publication: US 2024/0321964
Apparatus and Method for Detecting Foreign Substance
Application: 17/909,692 →
Apparatus and Method for Estimating State of Charge of Battery on Basis of Coulomb Counter
Application: 17/916,409 →
Publication: US 2023/0152381
Contact Structure of Semiconductor Device and Manufacturing Method Therefor
Application: 18/523,509 →
Publication: US 2024/0178058
Gate-Source Structure and Manufacturing Method Thereof, and Asymmetric Trench Mosfet and Manufacturing Method Thereof
Application: 18/390,943 →
Publication: US 2024/0355925
Ldmos Device and Method for Fabricating the Same
Application: 17/951,589 →
Publication: US 2023/0096725
Ldmos Transistor and Manufacturing Method Thereof
Application: 17/508,251 →
Publication: US 2022/0130981
Metal Oxide Semiconductor Device and Method for Manufacturing the Same
Application: 17/952,778 →
Publication: US 2023/0170401
Method for Manufacturing Trench Mosfet
Application: 18/183,789 →
Publication: US 2024/0128370
Method for Manufacturing Trench Mosfet
Application: 16/149,255 →
Publication: US 2019/0109216
Shielded-Gate-Trench Semiconductor Structure and Shielded-Gate-Trench Semiconductor Device
Application: 17/946,920 →
Publication: US 2023/0112544
SiC VDMOSFET HAVING CONTACT REGION FORMED BETWEEN SOURCE REGIONS AND WITHIN A BASE REGION
Application: 17/394,879 →
Publication: US 2022/0052176
Silicon Carbide Mosfet Device and Manufacturing Method Thereof
Application: 17/479,314 →
Publication: US 2022/0093768
Silicon Carbide Power Semiconductor Device Having Reduced Specific On-Resistance
Application: 17/931,034 →
Publication: US 2023/0117590
Super-Junction Mos Device with Integrated Tmbs Structure and Manufacturing Method Thereof
Application: 17/903,745 →
Publication: US 2024/0079445
Super-Junction Semiconductor Device with Enlarged Process Window for Desirable Breakdown Voltage
Application: 17/985,489 →
Publication: US 2023/0178591
Super-Junction Vdmos Device with Low On-Resistance
Application: 18/054,557 →
Publication: US 2023/0207619
Trench Field-Effect Transistor and Method for Manufacturing Trench Fet
Application: 18/475,883 →
Publication: US 2024/0105843
Trench Mosfet and Manufacturing Method Therefor
Application: 18/477,258 →
Publication: US 2024/0105792
Trench Mosfet and Method for Manufacturing the Same
Application: 17/113,305 →
Publication: US 2021/0184009
Vdmos Device and Method for Fabricating the Same
Application: 17/957,790 →
Publication: US 2023/0124282
Switched-Capacitor Converter with Power Delivery Regulation
Application: 19/265,327 →
Related Assignments (24)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 29, 2010
From: LEE, DONG-HUN; LEE, KYUNG-GOO; HAN, HONG-GYU; KIM, JUNG-WON
To: SILICON MITUS, INC.
Reel/Frame 024608/0552 →
Assignment of Assignor's Interest Oct 22, 2021
From: WANG, JIAKUN; WU, BING
To: HANGZHOU CHUANGQIN SENSOR TECHNOLOGY CO., LTD.
Reel/Frame 057877/0826 →
Assignment of Assignor's Interest Dec 22, 2021
From: HANGZHOU CHUANGQIN SENSOR TECHNOLOGY CO., LTD.
To: HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 058456/0860 →
Assignment of Assignor's Interest Sep 23, 2022
From: WU, BING
To: HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO.,LTD
Reel/Frame 061195/0615 →
Assignment of Assignor's Interest Nov 15, 2022
From: LEE, SANG WOO; KIM, DAE SUN; BAE, GI CHUR
To: SILICON MITUS, INC.; HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 061948/0671 →
Assignment of Assignor's Interest Dec 14, 2022
From: HONG, CHANG KI; PARK, CHANG SUB; KO, YOUNG SEOK
To: SILICON MITUS, INC.; HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 062127/0463 →
Assignment of Assignor's Interest May 3, 2023
From: CHOI, JAE SOON; LEE, HAK HEE; CHOI, SEOK MUN
To: SILICON MITUS, INC.; HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 063520/0248 →
Assignment of Assignor's Interest May 5, 2023
From: MOON, JUN HO; CHANG, IL KWON; PARK, SUNG JIN
To: SILICON MITUS, INC.; HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 063554/0978 →
Assignment of Assignor's Interest Jul 6, 2023
From: CHOI, JAE SOON; LEE, HAK HEE; CHOI, SEOK MUN
To: SILICON MITUS, INC.; HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 064171/0558 →
Assignment of Assignor's Interest Sep 5, 2023
From: YOON, KWANG HO; LIM, SU HUN; JUNG, JIN SU
To: SILICON MITUS, INC.; HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 064800/0439 →
Assignment of Assignor's Interest Nov 9, 2023
From: HONG, JI HOON
To: SILICON MITUS, INC.; HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 065514/0515 →
Assignment of Assignor's Interest Dec 20, 2023
From: CHANG, YOUNG JAE; LEE, SUNG RYONG; SHIM, JAE SAM
To: SILICON MITUS, INC.; HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 065918/0291 →
Assignment of Assignor's Interest Dec 26, 2023
From: MOON, JUN HO; CHANG, II KWON; PARK, SUNG JIN
To: SILICON MITUS, INC.; HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 065953/0864 →
Assignment of Assignor's Interest Dec 26, 2023
From: WANG, CHENHAN
To: HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 065953/0861 →
Assignment of Assignor's Interest Dec 29, 2023
From: CHANG, YOUNG JAE; LEE, SUNG RYONG; SHIM, JAE SAM
To: SILICON MITUS, INC.; HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 065978/0191 →
Assignment of Assignor's Interest Jan 9, 2024
From: LIU, JIAN; CAI, JINYONG
To: HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD
Reel/Frame 066070/0646 →
Assignment of Assignor's Interest Feb 15, 2024
From: LIU, JIAN
To: HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD
Reel/Frame 067110/0120 →
Assignment of Assignor's Interest Feb 20, 2024
From: PARK, BEOMHEE; CHOI, JAIHYUK; CHOI, JUNG SU; JEON, HYEON DEOK
To: SILICON MITUS, INC.; HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD
Reel/Frame 066498/0843 →
Assignment of Assignor's Interest Mar 5, 2024
From: OU, YANGGANG; LUO, JIAMIN
To: HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD
Reel/Frame 066652/0915 →
Assignment of Assignor's Interest Mar 12, 2024
From: CHANG, YOUNG JAE; LEE, SUNG RYONG; SHIM, JAE SAM
To: SILICON MITUS, INC.; HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD
Reel/Frame 066731/0878 →
Assignment of Assignor's Interest May 6, 2024
From: CHOI, JIN WOOK; CHOI, SEOK WON; CHOI, JUNG SU; BAE, GI CHUR
To: SILICON MITUS, INC.; HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 067326/0089 →
Assignment of Assignor's Interest Nov 5, 2024
From: MOON, JUN HO; CHANG, IL KWON
To: SILICON MITUS, INC.; HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 069135/0407 →
Assignment of Assignor's Interest Dec 10, 2024
From: PARK, HYUNG GU; MOON, JUN HO; CHA, SANG HYUN; CHANG, IL KWON
To: SILICON MITUS, INC.; HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
Reel/Frame 069540/0962 →
Assignment of Assignor's Interest Sep 19, 2025
From: HONG, CHANG KI; PARK, CHANG SUB; KO, YOUNG SEOK
To: SILICON MITUS, INC.; HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.(CHINA)
Reel/Frame 072946/0425 →