TRENCH FIELD-EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING TRENCH FET

1 . A method for manufacturing a trench field-effect transistor (FET), comprising:

forming an epitaxial layer on a substrate;

forming a trench in the epitaxial layer;

forming a first insulating layer and a shielding conductor in the trench, wherein the first insulating layer surrounds the shielding conductor;

forming a dielectric layer on the epitaxial layer, the first insulating layer, and a side wall of the trench;

etching a part of the dielectric layer to form a dielectric region, wherein the dielectric region is located on the first insulating layer and the side wall of the trench; and

forming a second insulating layer and a gate conductor in the trench, wherein the second insulating layer surrounds the gate conductor and fills the trench.

2 . The method for manufacturing a trench FET according to claim 1 , wherein the etching a part of the dielectric layer to form a dielectric region further comprises: forming a plurality of dielectric regions on the side wall of the trench, wherein a spacing is formed between two adjacent dielectric regions.

3 . The method for manufacturing a trench FET according to claim 1 , wherein the dielectric region is located between the shielding conductor and the gate conductor, and a distance between the dielectric region and the gate conductor is less than a distance between the dielectric region and the shielding conductor.

4 . The method for manufacturing a trench FET according to claim 1 , wherein the etching a part of the dielectric layer to form a dielectric region comprises:

etching a part of the dielectric layer located on the epitaxial layer, the first insulating layer, and the side wall of the trench through reactive ions, to form the dielectric layers respectively located on two opposite side walls of the trench, wherein the dielectric layers on the two opposite side walls of the trench are not connected to each other;

adjusting gas flow and a reaction time of a reactive ion gas, and etching a part of the dielectric layers located on the two opposite side walls of the trench again through the reactive ions; and

forming two dielectric regions respectively located on the first insulating layer and the two opposite side walls of the trench.

5 . The method for manufacturing a trench FET according to claim 1 , wherein the etching a part of the dielectric layer to form a dielectric region further comprises:

etching the dielectric layer on the epitaxial layer and a part of the dielectric layer in the trench through wet etching;

adjusting an etching solution concentration and an etching time for the wet etching, and etching the part of the dielectric layer located in the trench again through the wet etching; and

forming two dielectric regions respectively located on the first insulating layer and two opposite side walls of the trench.

6 . A trench field-effect transistor (FET), comprising:

a substrate;

an epitaxial layer, arranged on the substrate;

a trench, arranged in the epitaxial layer, wherein the trench extends from a surface of the epitaxial layer into the epitaxial layer;

an insulating layer, arranged in the trench;

a shielding conductor, arranged in the trench, wherein the shielding conductor is surrounded by the insulating layer and insulated from the epitaxial layer through the insulating layer;

a gate conductor, arranged in the trench, wherein the gate conductor is located on the shielding conductor and surrounded by the insulating layer and is insulated from the shielding conductor and the epitaxial layer through the insulating layer; and

a dielectric region, arranged between the shielding conductor and the gate conductor and located on a side wall of the trench.

7 . The trench FET according to claim 6 , wherein a distance between the dielectric region and the gate conductor is less than a distance between the dielectric region and the shielding conductor.

8 . The trench FET according to claim 6 , wherein a thickness of the insulating layer between the side wall of the trench and a side wall of the gate conductor is less than a thickness of the insulating layer between the side wall of the trench and a side wall of the shielding conductor.

9 . The trench FET according to claim 6 , wherein a plurality of dielectric regions are arranged, each of the dielectric regions is made of a low dielectric constant material, and a dielectric constant of the low dielectric constant material is less than 3.9.

10 . The trench FET according to claim 6 , wherein a plurality of dielectric regions are arranged, and when an even number of dielectric regions are arranged, the dielectric regions are symmetrical with respect to a center line of the gate conductor as an axis of symmetry.