Super-junction semiconductor device with enlarged process window for desirable breakdown voltage
A super-junction semiconductor device with an enlarged process window for a desirable breakdown voltage includes: a semiconductor substrate and an epitaxial layer deposited on the semiconductor substrate. The epitaxial layer includes a first semiconductor layer, and a second semiconductor layer disposed on the first semiconductor layer. A band gap of the first semiconductor layer is greater than a band gap of the second semiconductor layer. A super-junction structure is formed in the epitaxial layer, including at least one first epitaxial pillar of a first dopant type, and at least one second epitaxial pillar of a second dopant type. The first epitaxial pillar and the second epitaxial pillar are alternately arranged along a transverse direction. The epitaxial layer has a sandwich structure.
1 . A super-junction semiconductor device with an enlarged process window comprising:
a semiconductor substrate;
an epitaxial layer disposed on the semiconductor substrate,
wherein the epitaxial layer comprises a first semiconductor layer, a second semiconductor layer disposed on an upper surface of the first semiconductor layer, and a third semiconductor layer disposed on the lower surface of the first semiconductor layer,
wherein a band gap of the first semiconductor layer is greater than a band gap of the second semiconductor layer and a band gap of the third semiconductor layer; and
a super-junction structure formed in the epitaxial layer,
wherein the super-junction structure comprises at least one first epitaxial pillar of a first dopant type and at least one second epitaxial pillar of a second dopant type,
wherein the first epitaxial pillar and the second epitaxial pillar are alternately arranged along a transverse direction,
wherein the super-junction structure extends downwardly from an upper surface of the second semiconductor layer to a lower surface of the third semiconductor layer, and
wherein the first dopant type is opposite to the second dopant type.
2 . The super-junction semiconductor device of claim 1 , wherein the semiconductor substrate is a silicon substrate, the first semiconductor layer comprises silicon carbide or diamond, the second semiconductor layer comprises silicon, and the third semiconductor layer comprises silicon.
3 . The super-junction semiconductor device of claim 2 , wherein a thickness of the first semiconductor layer is greater than a thickness of the second semiconductor layer, and is greater than a thickness of the third semiconductor layer.
4 . The super-junction semiconductor device of claim 1 , wherein the first epitaxial pillar and the second epitaxial pillar are complementary inclined pillars.
5 . The super-junction semiconductor device of claim 1 , wherein the first dopant type is N type or P type, and the second dopant type is P type or N type.
6 . A super-junction diode comprising the super-junction semiconductor device of claim 1 .
7 . An insulated gate bipolar transistor comprising the super-junction semiconductor device of claim 1 .
8 . A vertical double-diffused metal oxide semiconductor device comprising the super-junction semiconductor device of claim 1 .
9 . The super-junction semiconductor device of claim 1 , wherein the first epitaxial pillar and the second epitaxial pillar are comprised in each of the first semiconductor layer and the second semiconductor layer.