IP Library Assignment 066070/0646
Patent Assignment
Reel/Frame 066070/0646

Assignment of Assignor's Interest

Recorded: 2024-01-09 Pages: 6
Assignors
LIU, JIAN
Executed: 2023-04-25
CAI, JINYONG
Executed: 2023-04-25
Assignee
HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD
NO. 6 LIANHUI STREET, XIXING STREET, BINJIANG DISTRICT, ZHEJIANG PROVINCE, HANGZHOU CITY, CHINA
Covered Property (1)
Trench Semiconductor Power Device and Layout Thereof
Application: 18/542,211 →
Publication: US 2024/0321964
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Aug 5, 2025
From: HANGZHOU SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY CO., LTD.
To: SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY (HANGZHOU) CO., LTD.
Reel/Frame 072337/0051 →