Patent Assignment
Reel/Frame 065537/0645
Assignment of Assignor's Interest
Recorded: 2023-11-13
Pages: 10
Assignors
FURUKAWA, SATOSHI
Executed: 2023-05-15
IWANO, TOMOHIRO
Executed: 2023-07-12
KUBOTA, SHIGEKI
Executed: 2023-05-17
UEDA, ATSUKO
Executed: 2023-05-12
KAGESAWA, KOICHI
Executed: 2023-10-17
Assignee
RESONAC CORPORATION
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Slurry, Polishing Method, and Method for Producing Semiconductor Component
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.