Patent Assignment
Reel/Frame 065543/0347
Assignment of Assignor's Interest
Recorded: 2023-11-13
Pages: 8
Assignors
WANG, XIANGYONG
Executed: 2023-10-25
KEHLET, DAVID
Executed: 2023-09-29
OJEDA ARISTIZABAL, DIANA CRISTINA
Executed: 2023-10-07
AVCI, MEHMET
Executed: 2023-09-29
KUON, IAN
Executed: 2023-09-29
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Timing Model for Chip-to-Chip Connection in a Package
Application:
18/375,299 →
Publication:
US 2024/0028815
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.