Patent Assignment
Reel/Frame 065543/0575
Assignment of Assignor's Interest
Recorded: 2023-11-13
Pages: 5
Assignors
HUANG, YU-LIEN
Executed: 2020-06-22
FU, CHING-FENG
Executed: 2020-06-22
LIN, HUAN-JUST
Executed: 2020-06-22
LI, FU-SHENG
Executed: 2020-06-22
HO, TSAI-JUNG
Executed: 2020-06-22
HSIEH, BOR CHIUAN
Executed: 2020-06-22
CHEN, GUAN-XUAN
Executed: 2020-06-22
WANG, GUAN-REN
Executed: 2020-06-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD., 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Gap Patterning for Metal-to-Source/Drain Plugs in a Semiconductor Device