Gap patterning for metal-to-source/drain plugs in a semiconductor device
A method may include forming a mask layer on top of a first dielectric layer formed on a first source/drain and a second source/drain, and creating an opening in the mask layer and the first dielectric layer that exposes portions of the first source/drain and the second source/drain. The method may include filling the opening with a metal layer that covers the exposed portions of the first source/drain and the second source/drain, and forming a gap in the metal layer to create a first metal contact and a second metal contact. The first metal contact may electrically couple to the first source/drain and the second metal contact may electrically couple to the second source/drain. The gap may separate the first metal contact from the second metal contact by less than nineteen nanometers.
1. A method for manufacturing a fin field-effect transistor (finFET), the method comprising:
providing a substrate;
forming a fin structure on the substrate;
forming a first source/drain plug and a second source/drain plug on the fin structure;
forming a sacrificial layer on the first source/drain plug and the second source/drain plug;
forming a gap in the sacrificial layer to form a first portion of the sacrificial layer and a second portion of the sacrificial layer;
filling the gap with a dielectric layer, wherein the dielectric layer is in contact with the first portion of the sacrificial layer and the second portion of the sacrificial layer based on filling the gap with the dielectric layer;
removing the first portion of the sacrificial layer and the second portion of the sacrificial layer to create a first opening that exposes the first source/drain plug and a second opening that exposes the second source/drain plug; and
filling the first opening and the second opening with a metal to form a first metal contact and a second metal contact, wherein the dielectric layer is in contact with the first metal contact and the second metal contact based on filling the first opening and the second opening with the metal.
2. The method of claim 1 , wherein forming the fin structure on the substrate comprises:
forming a first plurality of fins on the substrate; and
forming a second plurality of fins on the substrate; and
wherein forming the first source/drain plug and the second source/drain plug on the fin structure comprises:
forming the first source/drain plug on the first plurality of fins; and
forming the second source/drain plug on the second plurality of fins.
3. The method of claim 1 , further comprising:
forming a mask layer above the substrate; and
forming an opening in the mask layer to expose the first source/drain plug.
4. The method of claim 3 , wherein forming the sacrificial layer on the first source/drain plug comprises:
forming the sacrificial layer on the first source/drain plug based on the first source/drain plug being exposed.
5. The method of claim 4 , wherein the second source/drain plug is exposed based on forming the opening in the mask layer; and
wherein forming the sacrificial layer on the second source/drain plug comprises:
forming the sacrificial layer on the second source/drain plug based on the second source/drain plug being exposed.
6. The method of claim 3 , further comprising:
removing the mask layer based on forming the sacrificial layer.
7. The method of claim 1 , wherein the first metal contact and the second metal contact are separated by less than nineteen nanometers.
8. A method for manufacturing a fin field-effect transistor (finFET), the method comprising:
providing a substrate;
forming a fin structure on the substrate;
forming a source/drain epitaxial layer on the fin structure;
forming a layer on a surface of the source/drain epitaxial layer;
forming a gap between two portions of the layer;
filling the gap with a dielectric layer to form a spacer that is in contact with the two portions of the layer;
removing a first portion, of the two portions of the layer, to create an opening that exposes the source/drain epitaxial layer; and
filling the opening with a metal to form a metal contact that is in contact with the spacer.
9. The method of claim 8 , wherein forming the source/drain epitaxial layer on the fin structure comprises:
forming a source/drain plug on the fin structure.
10. The method of claim 8 , wherein forming the fin structure on the substrate comprises:
forming a first plurality of fins on the substrate; and
forming a second plurality of fins on the substrate; and
wherein forming the source/drain epitaxial layer on the fin structure comprises:
forming a first source/drain plug on the first plurality of fins; and
forming a second source/drain plug on the second plurality of fins.
11. The method of claim 10 , further comprising:
forming a mask layer above the substrate; and
forming an opening in the mask layer to expose the first source/drain plug.
12. The method of claim 11 , wherein forming the layer on the surface of the source/drain epitaxial layer comprises:
forming the layer on the first source/drain plug based on the first source/drain plug being exposed.
13. The method of claim 11 , further comprising:
removing the mask layer based on forming the layer on the surface of the source/drain epitaxial layer.
14. The method of claim 10 ,
wherein a width of the gap is less than nineteen nanometers.
15. The method of claim 14 , further comprising:
removing a second portion, of the two portions of the layer, to create another opening that exposes the second source/drain plug; and
filling the other opening with the metal to form another metal contact.
16. A method for manufacturing a fin field-effect transistor (finFET), the method comprising:
providing a substrate;
forming a fin structure on the substrate;
forming a source/drain plug based on forming a source/drain epitaxial layer on the fin structure;
forming a sacrificial layer on a surface of the source/drain plug;
forming a gap in the sacrificial layer to form a first portion of the sacrificial layer and a second portion of the sacrificial layer;
filling the gap with a dielectric layer to form a spacer that is in contact with the first portion of the sacrificial layer and the second portion of the sacrificial layer;
removing the first portion of the sacrificial layer to create an opening that exposes the source/drain plug; and
filling the opening with a metal to form a metal contact that is in contact with the spacer.
17. The method of claim 16 , further comprising:
removing the second portion of the sacrificial layer to create another opening that exposes another source/drain plug; and
filling the other opening with the metal to form another metal contact.
18. The method of claim 17 , further comprising:
forming another dielectric layer above the metal contact and the other metal contact; and
forming vias in the other dielectric layer.
19. The method of claim 1 , further comprising:
forming another dielectric layer above the first metal contact and the second metal contact; and
forming vias in the other dielectric layer.
20. The method of claim 19 , further comprising:
forming a third metal contact in a first via of the vias; and
forming a fourth metal contact in a second via of the vias.