Assignment of Assignor's Interest

Recorded: 2023-11-16 Pages: 3

Assignor

TALLEDO, JEFFERSON SISMUNDO

Executed: 2023-11-13

Assignee

STMICROELECTRONICS, INC.

NO. 9 MOUNTAIN DRIVE, LIGHT INDUSTRY & SCIENCE PARK II, BRGY. LA MESA, CALAMBA CITY, 4027, PHILIPPINES

Covered Property (1)

Multidie Flip Chip Package with Heat Sink

Application: 63/599,651 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.