Patent Assignment
Reel/Frame 065588/0637
Assignment of Assignor's Interest
Recorded: 2023-11-16
Pages: 6
Assignors
KIM, CHANGOH
Executed: 2021-05-05
PARK, SEONGHWAN
Executed: 2021-05-07
PARK, KYOUNGHEE
Executed: 2021-05-06
JUNG, JINHEE
Executed: 2021-05-06
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method for Forming Electromagnetic Interference (EMI) Shielded Packages with Laser-Based Redistribution and Multi-Stacked Packages