Patent Assignment
Reel/Frame 065617/0180
Assignment of Assignor's Interest
Recorded: 2023-11-20
Pages: 4
Assignors
LEE, YA-HUEI
Executed: 2020-12-20
YEH, SHU-SHEN
Executed: 2020-12-20
HSU, KUO-CHING
Executed: 2020-12-20
LEU, SHYUE-TER
Executed: 2020-12-20
LIN, PO-YAO
Executed: 2020-12-20
JENG, SHIN-PUU
Executed: 2020-12-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Die Package with Conductive Line Crack Prevention Design