Patent Assignment
Reel/Frame 065635/0843
Assignment of Assignor's Interest
Recorded: 2023-11-21
Pages: 3
Assignors
WU, PING-JUNG
Executed: 2023-11-20
CHANG, KEN-YU
Executed: 2023-11-20
KO, HAO-WEN
Executed: 2023-11-20
WU, TSANG-JIUH
Executed: 2023-11-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
3DIC with Gap-Fill Structures and the Method of Manufacturing the Same