Patent Assignment
Reel/Frame 065646/0967
Assignment of Assignor's Interest
Recorded: 2023-11-22
Pages: 5
Assignors
YU, CHENG-YEN
Executed: 2020-06-24
WU, PO-CHI
Executed: 2020-06-24
LAI, YUEH-CHUN
Executed: 2020-06-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
A Semiconductor Device for Recessed Fin Structure Having Rounded Corners