IP Library › Assignment 065670/0256
Patent Assignment
Reel/Frame 065670/0256

Assignment of Assignor's Interest

Recorded: 2023-11-27 Pages: 4
Assignors
GONG, ZHIWEI
Executed: 2023-11-17
VISWANATHAN, LAKSHMINARAYAN
Executed: 2023-11-20
LI, LI
Executed: 2023-11-20
Assignee
NXP USA, INC.
6501 WILLIAM CANNON DRIVE WEST, AUSTIN, TEXAS, 78735
Covered Property (1)
Molded Packages with Through-Mold Interconnects
Application: 18/518,377 →
Publication: US 2025/0168987